AS TEHNOINFORM invites you to meet at INTERPACK 2026
A representative of AS TEHNOINFORM will visit one of the world’s largest international exhibitions for packaging and processing technologies — INTERPACK 2026, which will take place from May 7 to May 13, 2026 in Düsseldorf, Germany.

During the exhibition, you can meet us at Hall 8, Stand E33. We invite our existing and new clients, as well as business partners, to meet with us to discuss cooperation opportunities and our offered solutions.

INTERPACK is one of the most important industry events in the world, presenting the latest technologies and solutions in packaging, labeling, paper, and printing. Participation in the exhibition allows us to expand cooperation, find new clients, and offer even more efficient solutions to our partners.

We kindly invite you to contact us in advance to arrange a meeting during the exhibition.